Title :
An Insight into R&D Collaborations
Author :
Fiaz, Muhammad ; Naiding, Yang ; Rizwan, Muhammad
Author_Institution :
Sch. of Manage., Northwestern Polytech. Univ., Xi´´an, China
Abstract :
This article is premeditated to give an insight about a symmetrical R&D culture of integrity and sharing of innovative knowledge and for highlighting a paradigm shift in R&D Collaboration towards University-Industry R&D Collaboration. The concept of R&D collaboration is being overwhelmingly consented and admired by small and large organizations all over the world. Developed countries have shown more emphasis on R&D Collaboration as compared with the developing nations. Collaboration can be organization-organization or organization - universities for R&D projects. Presently, more emphasis is on developing articulated culture for research oriented environment by collaboration between universities and industry for knowledge sharing and communication in joint projects. The underlying idea behind these collaborations is to use the university R&D resources as being economical and to having more easiness of access. The article also highlights the factors affecting the University-Industry collaboration and challenges to these collaborations. This article depicts the paradigm shift of R&D collaboration towards University-Industry R&D collaboration for successful completion of R&D Projects. It also investigates the reasons behind doing or not doing the R&D Collaborations and the factors affecting the R&D Collaboration.
Keywords :
educational institutions; innovation management; knowledge management; research initiatives; developing nations; innovative knowledge sharing; knowledge communication; university-industry R&D collaboration; Collaboration; Economics; Industries; Joints; Organizations; Security; Technological innovation; R&D; University-Industry Collaboration; knowledge Sharing;
Conference_Titel :
Technology Management Conference (ITMC), 2011 IEEE International
Conference_Location :
San Jose, CA
Print_ISBN :
978-1-61284-951-5
DOI :
10.1109/ITMC.2011.5995952