Title :
Concurrent thermal design: balancing accuracy with time constraints
Author :
Nigen, J.S. ; Amon, C.H.
Author_Institution :
Dept. of Mech. Eng., Carnegie Mellon Univ., Pittsburgh, PA, USA
Abstract :
A thermal design methodology suitable for concurrent design of cost-driven electronic systems is proposed and exemplified for a sample board. This design methodology utilizes an evolutionary concept, in which the analysis tools are capable of adjusting their level of complexity as the design evolves, initiating with rough approximate analyses and culminating in a conjugate conduction/convection simulation for a portion of the sample board. The level of approximation included at each stage of the design is selected with consideration of both time and accuracy constraints. The importance of considering the conjugate problem in generating heat transfer correlations for electronic packages is discussed
Keywords :
cooling; design engineering; packaging; printed circuit design; accuracy-time tradeoff; air-cooling; concurrent design; conduction/convection simulation; conjugate problem; cost-driven electronic systems; electronic packages; evolutionary concept; heat transfer correlations; initial rough approximation; level of approximation; sample board; thermal design methodology; Cooling; Design engineering; Design methodology; Heat transfer; Mechanical engineering; Product design; Production; Temperature distribution; Thermal management; Time factors;
Conference_Titel :
Thermal Phenomena in Electronic Systems, 1992. I-THERM III, InterSociety Conference on
Conference_Location :
Austin, TX
Print_ISBN :
0-7803-0503-5
DOI :
10.1109/ITHERM.1992.187735
