• DocumentCode
    2924099
  • Title

    Optimization of the thermal design of a cryogenically-cooled computer

  • Author

    Anderson, James ; Krane, Robert J. ; Parsons, J.R. ; Cohen, A. Bar

  • Author_Institution
    Dept. of Mech. & Aerosp. Eng., Tennessee Univ., Knoxville, TN, USA
  • fYear
    1992
  • fDate
    5-8 Feb 1992
  • Firstpage
    85
  • Lastpage
    95
  • Abstract
    The performance and costs of three types of cryogenic cooling systems are analyzed; a once-through system in which liquid nitrogen is allowed to boil on the CPU boards and is then vented to the surroundings; a saturated pool boiling refrigerated system in which gaseous nitrogen generated from boiling on the CPU boards in condensed in the vapor space above the liquid nitrogen pool; and a subcooled pool boiling refrigerated system in which the condenser is completely submerged in a subcooled liquid nitrogen pool surrounding the CPU boards. Thermal/fluid numerical models used in conjunction with an optimization code GRG2, were used to predict the performance and cost of the cryogenic cooling systems. The uniform annual cost of the once-through system was calculated to be $28.8 K. This compares with $34.6 K for the optimal saturated pool boiling system and $34.7 K for the optimal subcooled pool boiling system. Due to the extremely high initial cost of the refrigerated systems, the once-through cryogenic cooling system is recommended if the local heat flux on the CPU board remains below 15 W/cm2
  • Keywords
    cooling; design engineering; low-temperature production; nitrogen; packaging; CPU boards; annual cost; boiling N2; costs; cryogenic cooling systems; cryogenically-cooled computer; heat flux; initial cost; liquid N2 cooling; once-through system; optimization; performance; saturated pool boiling refrigerated system; subcooled pool boiling refrigerated system; thermal design; Central Processing Unit; Costs; Cryogenics; Design optimization; Heat transfer; Nitrogen; Refrigeration; Space cooling; Space heating; Temperature;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Thermal Phenomena in Electronic Systems, 1992. I-THERM III, InterSociety Conference on
  • Conference_Location
    Austin, TX
  • Print_ISBN
    0-7803-0503-5
  • Type

    conf

  • DOI
    10.1109/ITHERM.1992.187744
  • Filename
    187744