Cooling characteristics of forced air convection in electronic cabinets

Author

Kim, Won Tae ; Park, J.H. ; Rho, H.G. ; Kim, K.S.

Author_Institution

Electron. & Telecommun. Res. Inst., Taejeon, South Korea

fYear

1992

fDate

5-8 Feb 1992

Firstpage

137

Abstract

Summary form only given. Air-cooled forced convection in vertical channels installed in electronic cabinets has been investigated experimentally and numerically. The heat transfer characteristics were determined experimentally and numerical simulation was performed using a finite-difference method for the electronic components based on the experimental results. In the experimental study, attention is focused on the relation between Rayleigh number and Nusselt number; the maximum temperature difference of the powered PCB; varying the heat flux; the spacing of the vertical channels; and the Reynolds number at inlet condition Re=1.5×10³ to 1.2×10⁴. The heat transfer characteristics of uniform heating for each module were compared with those for nonuniform heating. Some interesting phenomena in the laminar-turbulent region were also observed

Keywords

cooling; digital simulation; packaging; printed circuits; Nusselt number; Rayleigh number; electronic cabinets; finite-difference method; forced air convection; heat flux; heat transfer characteristics; laminar-turbulent region; maximum temperature difference; numerical simulation; powered PCB; spacing; vertical channels; Cities and towns; Electronic components; Electronics cooling; Finite difference methods; Heat transfer; Numerical simulation; Performance analysis; Temperature;

fLanguage

English

Publisher

ieee

Conference_Titel

Thermal Phenomena in Electronic Systems, 1992. I-THERM III, InterSociety Conference on

Conference_Location

Austin, TX

Print_ISBN

0-7803-0503-5

Type

conf

DOI

10.1109/ITHERM.1992.187751

Filename

187751