Temperature solution o f five-layer structure with an embedded circular source

The temperature solution of a five-layer structure with an embedded circular source is reported. The solution is in the form of single integration rather than the double integration of solution for a structure with a rectangular source. An algorithm is developed for effective and accurate calculation of the integral solution. Using the circular source solution, the CPU time for temperature calculation is reduced by a factor of 10 as compared to the rectangular source solution. An important application for the solution is the use of a circular source instead of a square source as the unit source to produce the unit thermal profile for real-time thermal design of integrated circuits. The solution is also valuable for the thermal study and analysis of devices having circular sources such as power transistors and light emitting diodes. An application example is presented