DocumentCode
2924849
Title
Diamond bonding and metallization for electron transmission cathodes
Author
Shaw, Jonathan L. ; Wood, Franklin N. ; Yater, Joan E. ; Jensen, Kevin L. ; Pate, Bradford B. ; Hanna, Jeremy M. ; Myers, Robert E. ; Feigelson, Tatyana
Author_Institution
Naval Res. Lab., Washington, DC, USA
fYear
2012
fDate
24-26 April 2012
Firstpage
441
Lastpage
442
Abstract
We report progress in mounting small thin diamond sheets over holes in larger substrates in a manner that allows electron beam amplification. In addition to a physical mount, our bonding method must be compatible with the creation and maintenance of the negative electron affinity surface and operation at elevated temperatures. We use a transient liquid phase bonding method wherein the constituent metals react to increase their melting point and also reduce their vapor pressure.
Keywords
bonding processes; cathodes; diamond; electron sources; metallisation; sputter deposition; C; affinity surface; beam amplification; bonding method; diamond bonding; diamond metallization; diamond sheet; electron transmission cathode; melting point; transient liquid phase bonding method; vapor pressure; Bonding; Diamond-like carbon; Nickel; Substrates; Surface contamination; Tin; TLP bonding; diamond; electron beam amplifier;
fLanguage
English
Publisher
ieee
Conference_Titel
Vacuum Electron Sources Conference (IVESC), 2012 IEEE Ninth International
Conference_Location
Monterey, CA
Print_ISBN
978-1-4673-0368-2
Type
conf
DOI
10.1109/IVESC.2012.6264196
Filename
6264196
Link To Document