DocumentCode :
2925113
Title :
Statistical modeling and analysis of chip-level leakage power by spectral stochastic method
Author :
Shen, Ruijing ; Mi, Ning ; Tan, Sheldon X D ; Cai, Yici ; Hong, Xianlong
Author_Institution :
Dept. of Electr. Eng., Univ. of California, Riverside, CA
fYear :
2009
fDate :
19-22 Jan. 2009
Firstpage :
161
Lastpage :
166
Abstract :
In this paper, we present a novel statistical full-chip leakage power analysis method. The new method can provide a general framework to derive the full-chip leakage current or power in a closed form in terms of the variational parameters, such as the channel length, the gate oxide thickness, etc. It can accommodate various spatial correlations. The new method employs the orthogonal polynomials to represent the variational gate leakages in a closed form first, which is generated by a fast multi-dimensional Gaussian quadrature method. The total leakage currents then are computed by simply summing up the resulting orthogonal polynomials (their coefficients). Unlike many existing approaches, no grid-based partitioning and approximation are required. Instead, the spatial correlations are naturally handled by orthogonal decompositions. The proposed method is very efficient and it becomes linear in the presence of strong spatial correlations. Experimental results show that the proposed method is about 10times faster than the recently proposed method with constant better accuracy.
Keywords :
Gaussian processes; digital circuits; leakage currents; polynomials; gate oxide thickness; multidimensional Gaussian quadrature method; orthogonal polynomials; spatial correlations; spectral stochastic method; statistical full-chip leakage power analysis method; variational gate leakages; Circuits; Computer science; Gate leakage; Independent component analysis; Leakage current; Polynomials; Principal component analysis; Stochastic processes; Subthreshold current; Threshold voltage;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Design Automation Conference, 2009. ASP-DAC 2009. Asia and South Pacific
Conference_Location :
Yokohama
Print_ISBN :
978-1-4244-2748-2
Electronic_ISBN :
978-1-4244-2749-9
Type :
conf
DOI :
10.1109/ASPDAC.2009.4796474
Filename :
4796474
Link To Document :
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