• DocumentCode
    2925515
  • Title

    The JCT buried BSF silicon solar cell a model of simplicity and high efficiency

  • Author

    Mandelkorn, J. ; Broder, J. ; Kreinin, L. ; Bordin, N. ; Eisenberg, N.P.

  • Author_Institution
    Jerusalem Coll. of Technol., Israel
  • Volume
    2
  • fYear
    1994
  • fDate
    5-9 Dec 1994
  • Firstpage
    1470
  • Abstract
    The term BSF is defined as an electric field region created by diffusion of a dopant of the same type as present in the base region of a solar cell into the back surface of the cell. The buried BSF is then defined as a BSF buried beneath a heavily doped, multicrystalline, silicon-silicon oxide layer. A simple process for fabricating a buried BSF and an optimum emitter for an n+, p, p+ silicon solar cell is described. The buried BSF, at present, provides 0.63 volt Voc, under AM1 illumination, and 1000 μm base minority carrier diffusion length when made in 100 ohm cm silicon. An attempt is being made to utilize the buried BSF to achieve a useful high efficiency cell, possessing long term reliability and acceptable manufacturing cost
  • Keywords
    carrier lifetime; elemental semiconductors; minority carriers; semiconductor device reliability; semiconductor doping; semiconductor materials; silicon; solar cells; AM1 illumination; JCT buried BSF silicon solar cell; Si; Si solar cell; back surface; electric field region; heavily doped layer; high efficiency; long term reliability; minority carrier diffusion length; multicrystalline layer; optimum emitter; silicon-silicon oxide layer; Etching; Fabrication; Furnaces; Lighting; Nitrogen; Passivation; Photovoltaic cells; Semiconductor process modeling; Silicon compounds; Temperature;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Photovoltaic Energy Conversion, 1994., Conference Record of the Twenty Fourth. IEEE Photovoltaic Specialists Conference - 1994, 1994 IEEE First World Conference on
  • Conference_Location
    Waikoloa, HI
  • Print_ISBN
    0-7803-1460-3
  • Type

    conf

  • DOI
    10.1109/WCPEC.1994.520227
  • Filename
    520227