• DocumentCode
    2925534
  • Title

    Needs and trends in embedded software development for consumer electronics

  • Author

    Tsunakawa, Yasutaka

  • Author_Institution
    Design Platform Div., Sony Corp., Atsugi
  • fYear
    2009
  • fDate
    19-22 Jan. 2009
  • Firstpage
    301
  • Lastpage
    303
  • Abstract
    Like other domains, the flow to many-core can not be avoided in the domain of the consumer electronics either. The multi-core has already become the mainstream of the system LSI, and the number of cores in the chip will continue to increase. Because of the advancement of required functions and the pressure to the consumption electricity reduction, the flow to many-core will continue without cessation. However, seeing it from a point of view of the embedded software development, there are many unsolved problems that lie like a huge cliff between the current multi-core and many-core. The research organizations seem to make their main efforts in technical establishment of many-core, and the tool vendors concentrates on a solution offer to the current multi-core. Therefore measures of the transition period will come several years later are still insufficient. In this article, I want to discuss about the major issues which block the shift to many-core from the current multi-core, from the viewpoint of consumer electronics.
  • Keywords
    consumer electronics; embedded systems; large scale integration; multiprocessing systems; consumer electronics; consumption electricity reduction; embedded software development; manycore; multicore; system LSI; Circuits; Computer architecture; Consumer electronics; Embedded software; Energy consumption; Large scale integration; Software algorithms; Software performance; Technological innovation; User interfaces;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Design Automation Conference, 2009. ASP-DAC 2009. Asia and South Pacific
  • Conference_Location
    Yokohama
  • Print_ISBN
    978-1-4244-2748-2
  • Electronic_ISBN
    978-1-4244-2749-9
  • Type

    conf

  • DOI
    10.1109/ASPDAC.2009.4796497
  • Filename
    4796497