Title :
Via hole modeling for an electromagnetically coupled patch antenna
Author :
Ming-Ju Tsai ; Alexopoulos, N.G.
Author_Institution :
Dept. of Electr. Eng., California Univ., Los Angeles, CA, USA
Abstract :
In microwave and millimeter wave applications, microstrip antennas with a multilayered configuration are becoming more popular and important. A practical excitation mechanism for such antennas is electromagnetically coupled (EMC) feeding through a microstrip line. In comparison with other feeding structures, the main features of EMC microstrip antennas include larger bandwidth, higher efficiency, lower radiation from the feed line and better impedance matching flexibility. In the paper, a 3-D full-wave spectral-domain technique is developed to investigate the insertion of a via hole in an EMC patch antenna. The result shows that perfect matching and a larger bandwidth can be achieved by use of the via hole.<>
Keywords :
antenna feeds; antenna radiation patterns; impedance matching; microstrip antennas; microstrip lines; spectral-domain analysis; 3-D full-wave spectral-domain technique; EMC microstrip antennas; bandwidth; efficiency; electromagnetically coupled feeding; electromagnetically coupled patch antenna; excitation mechanism; feed line; impedance matching; microstrip antennas; microstrip line; multilayered configuration; via hole; Antenna feeds; Bandwidth; Electromagnetic compatibility; Electromagnetic coupling; Electromagnetic modeling; Impedance matching; Microstrip antennas; Microwave antennas; Millimeter wave technology; Patch antennas;
Conference_Titel :
Antennas and Propagation Society International Symposium, 1994. AP-S. Digest
Conference_Location :
Seattle, WA, USA
Print_ISBN :
0-7803-2009-3
DOI :
10.1109/APS.1994.407876
