DocumentCode :
292661
Title :
The influence of metallization thickness on a microstripline-fed patch antenna
Author :
Tzyy-Sheng Horng ; Ming-Ju Tsai ; Ching-Lung Chen ; Alexopoulos, N.G.
Author_Institution :
Dept. of Electr. Eng., Nat. Sun Yat-Sen Univ., Kaohsiung, Taiwan
Volume :
2
fYear :
1994
fDate :
20-24 June 1994
Firstpage :
940
Abstract :
In the past, integral-equation modeling techniques such as the spectral-domain electric-field integral equation (EFIE) and the mixed-potential integral equation (MPIE) have been employed to accurately characterize microstrip patch antennas. However, due to an insufficient segmentation scheme for current densities inside a finitely thick microstrip, these methods are limited to an idealized microstrip patch with infinitesimal thickness. In the present paper, the spectral-domain EFIE formulation in conjunction with a suitable current expansion mechanism (first introduced in Becks and Wolff, 1992) for analysis of a microstrip via-holes and air-bridges, is used to evaluate the finite metallization thickness effects. For the first time, very rigorous theoretical results are demonstrated to illustrate the influence of metallization thickness on resonant frequency, reflection coefficient and current distribution of a microstripline-fed patch antenna.<>
Keywords :
antenna feeds; antenna theory; current density; current distribution; electric fields; electromagnetic wave reflection; integral equations; metallisation; microstrip antennas; spectral-domain analysis; 7.0 to 8.5 GHz; SHF; current densities; current expansion mechanism; electric-field integral equation; metallization thickness; microstripline-fed patch antenna; reflection coefficient; resonant frequency; spectral-domain EFIE formulation; Current density; Current distribution; Geometry; Impedance; Integral equations; Metallization; Microstrip antennas; Patch antennas; Reflection; Resonant frequency;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Antennas and Propagation Society International Symposium, 1994. AP-S. Digest
Conference_Location :
Seattle, WA, USA
Print_ISBN :
0-7803-2009-3
Type :
conf
DOI :
10.1109/APS.1994.407923
Filename :
407923
Link To Document :
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