• DocumentCode
    2927157
  • Title

    Preliminary evaluation of flat glass backed mica paper tape for high voltage coil groundwall insulation using vacuum-pressure-impregnation

  • Author

    Emery, F. Tim ; Williams, Mark

  • Author_Institution
    Siemens Energy Inc., Charlotte, NC, USA
  • fYear
    2011
  • fDate
    5-8 June 2011
  • Firstpage
    175
  • Lastpage
    179
  • Abstract
    Of interest, is to find a glass backed mica paper tape with improved dielectric properties than commercially available tapes [1]. This paper is a second on the subject and presents the results of a preliminary evaluation of flat glass backed mica paper tape. These tapes were evaluated for possible use for high voltage coil groundwall insulation using vacuum-pressure-impregnation (VPI) with epoxy resins. Flat Glass Mica Paper tape was used to insulate aluminum test bars and impregnated using a VPI process using epoxy resin. The impregnating resin and process is used in the fabrication and processing of high voltage stator coils usually insulated with glass backed mica paper tape. An evaluation of the insulated test bars was done and the results are compared to other commercially available glass backed mica paper taped test bars; processed and evaluated under identical conditions. The flat glass mica paper tape was used to make up insulated full size stator coils which in turn were subject to electrical, chemical, and mechanical testing. This paper reviews the results of the evaluation of the flat glass mica paper tape; showing good dielectric properties that make it suitable for use in high voltage coil insulation.
  • Keywords
    bars; coils; dielectric properties; insulation testing; mica; chemical testing; dielectric properties; electrical testing; epoxy resins; flat glass backed mica paper tape; high voltage coil groundwall insulation; high voltage stator coils; mechanical testing; vacuum-pressure-impregnation; Bars; Coils; Glass; Insulation; Reactive power; Resins; Stators;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Insulation Conference (EIC), 2011
  • Conference_Location
    Annapolis, MD
  • ISSN
    pending
  • Print_ISBN
    978-1-4577-0278-5
  • Electronic_ISBN
    pending
  • Type

    conf

  • DOI
    10.1109/EIC.2011.5996141
  • Filename
    5996141