DocumentCode
2927265
Title
9.3: Fabrication of solid copper 220 GHz folded waveguide circuits by UV lithography
Author
Makarova, Olga V. ; Divan, Ralu ; Tucek, John ; Kreischer, Kenneth ; Amstutz, Platte T. ; Mancini, Derrick C. ; Tang, Cha-Mei
Author_Institution
Creatv MicroTech, Inc., Chicago, IL, USA
fYear
2010
fDate
18-20 May 2010
Firstpage
183
Lastpage
184
Abstract
We report the fabrication results for an all-copper 220 GHz folded waveguide circuit. The fabrication method is based on UV lithography using SU-8 negative photoresist followed by copper electroforming. The method achieved the necessary dimensional accuracy, smooth vertical side walls, low cost of fabrication, and all-copper structure suitable for high power applications.
Keywords
copper; electroforming; photoresists; ultraviolet lithography; waveguides; SU-8 negative photoresist; UV lithography; copper electroforming; folded waveguide circuit; frequency 220 GHz; solid copper; Circuits; Copper; Electron beams; Etching; Geometry; Gratings; Lithography; Optical device fabrication; Solids; Thermal conductivity; 220 GHz waveguide; HiFIVE; LIGA; SU-8; UV lithography; folded waveguide circuit;
fLanguage
English
Publisher
ieee
Conference_Titel
Vacuum Electronics Conference (IVEC), 2010 IEEE International
Conference_Location
Monterey, CA
Print_ISBN
978-1-4244-7098-3
Type
conf
DOI
10.1109/IVELEC.2010.5503541
Filename
5503541
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