DocumentCode
2927284
Title
9.4: MEMS fabrication of 0.22 THz sheet beam TWT circuit
Author
Shin, Young-Min ; Baig, Anisullah ; Gamzina, Diana ; Luhmann, Neville C., Jr.
Author_Institution
Dept. of Appl. Sci., Univ. of California - Davis (UCD), Davis, CA, USA
fYear
2010
fDate
18-20 May 2010
Firstpage
185
Lastpage
186
Abstract
0.22 THz sheet beam traveling wave tube amplifier (TWTA) circuits fabricated by microelectro mechanical system (MEMS) processes are under investigation for submillimeter wave applications. Currently, we are investigating three different methods; KMPR UV-LIGA and nano CNC machining. Eigenmode transient simulations show that, accounting for realistic values of our currently achievable fabrication tolerances, the transmission, and dispersion properties of the operation modes of a TE-mode, staggered, double grating circuit are maintained within less than 1 dB and 2% deviation, respectively. Scanning electron microscopy and atomic force microscopy analyses of the fabricated circuit samples demonstrate that both of the MEMS fabrication approaches produce circuits with ± 3 - 5 μm dimensional tolerance and ~ 30 nm surface roughness. Currently, the fabricated circuits are being cold-tested and process conditions will be re-adjusted with respect to a test result for optimization.
Keywords
micromachining; micromechanical devices; travelling wave amplifiers; travelling wave tubes; KMPR UV-LIGA; MEMS fabrication; atomic force microscopy; double grating circuit; eigenmode transient simulation; frequency 0.22 THz; microelectro mechanical system; nano CNC machining; scanning electron microscopy; sheet beam TWT circuit; sheet beam traveling wave tube amplifier circuits; submillimeter wave application; Atomic force microscopy; Circuit testing; Computer numerical control; Fabrication; Mechanical systems; Micromechanical devices; Scanning electron microscopy; Submillimeter wave circuits; Submillimeter wave devices; Submillimeter wave propagation; KMPR; LIGA; MEMS; THz; TWTA; sheet beam; submillimeter;
fLanguage
English
Publisher
ieee
Conference_Titel
Vacuum Electronics Conference (IVEC), 2010 IEEE International
Conference_Location
Monterey, CA
Print_ISBN
978-1-4244-7098-3
Type
conf
DOI
10.1109/IVELEC.2010.5503542
Filename
5503542
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