Title :
P1–26: High temperature brazing using nano-particles doped filler metal for dispenser cathode applications
Author :
Busbaher, Daniel ; Liu, Wen ; Sekulic, Dusan P.
Author_Institution :
Semicon Assoc., Lexington, KY, USA
Abstract :
Flow of molten filler metal during high temperature brazing is a critical phenomenon in materials processing essential for dispenser cathode manufacturing. The presence of nano-particles in filler composite materials may impact resulting bond properties and joint integrity. This paper offers an insight into a new study of joint formation and behavior of the Mo/Ni braze filler doped by Mo/Ni nano-particles.
Keywords :
brazing; cathodes; filler metals; high-temperature techniques; nanocomposites; nanoparticles; dispenser cathode manufacturing; high temperature brazing; materials processing; nanoparticles doped filler composite materials; Atmosphere; Bonding; Cathodes; Composite materials; Copper; Filler metals; Manufacturing; Temperature; Testing; Tungsten; dispenser cathode; high temperature brazing; manufacturing; nano-composites;
Conference_Titel :
Vacuum Electronics Conference (IVEC), 2010 IEEE International
Conference_Location :
Monterey, CA
Print_ISBN :
978-1-4244-7098-3
DOI :
10.1109/IVELEC.2010.5503557
