Title :
Optimal placement of heat dissipating elements [ hybrid power circuits ]
Author_Institution :
Inst. of Electron. AGH, Krakow, Poland
fDate :
30 May-2 Jun 1994
Abstract :
An effective numerical method makes it possible to find such location of heat dissipating elements that the greatest temperature of elements sensitive to the temperature is as low as possible
Keywords :
circuit CAD; cooling; hybrid integrated circuits; integrated circuit design; power integrated circuits; cooling; element location; heat dissipating elements; hybrid power circuits; numerical method; optimal placement; Aluminum oxide; Boundary conditions; Conducting materials; Cooling; Integral equations; Monolithic integrated circuits; Resistors; Temperature distribution; Temperature sensors; Thermal conductivity;
Conference_Titel :
Circuits and Systems, 1994. ISCAS '94., 1994 IEEE International Symposium on
Conference_Location :
London
Print_ISBN :
0-7803-1915-X
DOI :
10.1109/ISCAS.1994.408764
