DocumentCode
2928450
Title
Evaluation of epoxy nanocomposites for electrical insulation systems
Author
Zhao, Su ; Hillborg, Henrik ; Mårtensson, Eva ; Paulsson, Göran
Author_Institution
ABB Discrete Autom. & Motion, ABB Corp. Res., Vasteras, Sweden
fYear
2011
fDate
5-8 June 2011
Firstpage
489
Lastpage
492
Abstract
Epoxy nanocomposites can be used as electrical insulation material in various high voltage applications, due to their improved ductility, fatigue resistance, in combination with enhanced electrical properties, compared to the neat epoxy. In a previous work, the mechanisms leading to these improvements in Al2O3 nanoparticles filled epoxy nanocomposites were investigated on lab scale samples (<; 100 ml). It was shown that a homogenous dispersion of the nanoparticles in the matrix was required for achieving such improvements. In the present study, different dispersion techniques were used for preparing Al2O3/epoxy nanocomposites on a larger scale (>; 5L). The glass transition temperature of all formulations remained the same as the base resin. The nanocomposite with the best dispersion maintained the dielectric properties, and exhibited a 40 % increase in elongation at break, with improved tensile modulus, thermal conductivity, and AC break down strength (slightly increased mean value and significantly reduced scatter), compared with the base resin.
Keywords
dielectric properties; electric breakdown; elongation; epoxy insulation; glass transition; nanocomposites; nanofabrication; nanoparticles; resins; thermal conductivity; AC break down strength; dielectric property; dispersion technique; electrical insulation material; enhanced electrical property; fatigue resistance; glass transition temperature; high voltage application; nanoparticle filled epoxy nanocomposite; thermal conductivity; Aluminum oxide; Dispersion; Electric breakdown; Epoxy resins; Nanocomposites; Nanoparticles; dispersion; insulation property; nanocomposite;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Insulation Conference (EIC), 2011
Conference_Location
Annapolis, MD
ISSN
pending
Print_ISBN
978-1-4577-0278-5
Electronic_ISBN
pending
Type
conf
DOI
10.1109/EIC.2011.5996205
Filename
5996205
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