• DocumentCode
    2928725
  • Title

    Mechanisms of retention loss in Ge2Sb2Te5-based Phase-Change Memory

  • Author

    Shih, Y.H. ; Wu, J.Y. ; Rajendran, B. ; Lee, M.H. ; Cheek, R. ; Lamorey, M. ; Breitwisch, M. ; Zhu, Y. ; Lai, E.K. ; Chen, C.F. ; Stinzianni, E. ; Schrott, A. ; Joseph, E. ; Dasaka, R. ; Raoux, S. ; Lung, H.L. ; Lam, C.

  • fYear
    2008
  • fDate
    15-17 Dec. 2008
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    Data retention loss from the amorphous (RESET) state over time in Phase-Change Memory cells is associated with spontaneous crystallization. In this paper, the change in the threshold voltage (VT) of memory cells in the RESET state before and after heating is used as a probe into the nature of the retention loss mechanisms. Two mechanisms for the retention loss behavior are identified, responsible for the main distribution and the tail distribution, respectively. Experimental results suggest that (i) an optimized RESET operation produces a fully amorphized Ge2Sb2Te5 (aGST) active region, with no crystalline domains inside, (ii) cells in the tail distribution fail to retain their RESET state due to spontaneous generation of crystallization nuclei and grain growth, and (iii) cells in the main distribution fail due to grain growth from the amorphous/crystalline GST boundary, instead of nucleation within the active region.
  • Keywords
    amorphous semiconductors; antimony compounds; crystallisation; germanium compounds; phase change memories; Ge2Sb2Te5; RESET state; amorphous state; crystallization; phase-change memory; retention loss mechanism; Amorphous materials; Breakdown voltage; Crystallization; Grain boundaries; Heating; Phase change memory; Phase change random access memory; Probability distribution; Tail; Testing;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electron Devices Meeting, 2008. IEDM 2008. IEEE International
  • Conference_Location
    San Francisco, CA
  • ISSN
    8164-2284
  • Print_ISBN
    978-1-4244-2377-4
  • Electronic_ISBN
    8164-2284
  • Type

    conf

  • DOI
    10.1109/IEDM.2008.4796653
  • Filename
    4796653