DocumentCode :
292882
Title :
Transient simulation of coupled lossy interconnects by window partitioning technique
Author :
BANDI, Vijaya Gopal ; Asai, Hideki
Author_Institution :
Fac. of Eng., Shizuoka Univ., Hamamatsu, Japan
Volume :
1
fYear :
1994
fDate :
30 May-2 Jun 1994
Firstpage :
419
Abstract :
A new algorithm, which is incorporated into the waveform relaxation analysis, to compute the transient response of coupled lossy transmission lines is presented. First, coupled lines are transformed into uncoupled lines by a transformation network. Second, each uncoupled line is modelled into an equivalent disjoint two-port network. This model, called characteristic model, consists of characteristic impedances and voltage generators in each branch. Synthesized networks are used to represent characteristic impedances and attenuation functions. Finally, the circuit is partitioned into two subcircuits and waveform relaxation analysis is carried out in sequential time windows of size equal to the delay of an uncoupled line with fastest propagation velocity. By this approach, the near end and far end subcircuits are totally decoupled within each window and as a result converged waveforms are obtained with a single iteration
Keywords :
circuit analysis computing; distributed parameter networks; equivalent circuits; integrated circuit interconnections; iterative methods; transient analysis; transient response; transmission line theory; attenuation functions; characteristic impedances; characteristic model; coupled lossy interconnects; equivalent disjoint two-port network; lossy transmission lines; transient response; transient simulation; voltage generators; waveform relaxation analysis; window partitioning technique; Algorithm design and analysis; Computational modeling; Couplings; Impedance; Integrated circuit interconnections; Power system transients; Propagation losses; Transient response; Transmission lines; Voltage;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Circuits and Systems, 1994. ISCAS '94., 1994 IEEE International Symposium on
Conference_Location :
London
Print_ISBN :
0-7803-1915-X
Type :
conf
DOI :
10.1109/ISCAS.1994.408828
Filename :
408828
Link To Document :
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