DocumentCode
2928872
Title
Session 10: CMOS devices and technology - Vth variation and scaling
Author
Faynot, Olivier ; Breashears, Eddie
Author_Institution
CEA/LETI, USA
fYear
2008
fDate
15-17 Dec. 2008
Firstpage
1
Lastpage
1
Abstract
This session reports recent advanced progresses made in the field of Vth variability and scaling-related issues. The first paper reports 0.124 µm2 SRAM cell integration using high-K and metal gate allowing significant mismatch improvement. The second paper focuses on 0.128µm2 FinFet SRAM cell with proposed integration scheme to reduce Vth variation. The third paper provides optimized guidelines for FinFET SRAM scaling. The fourth paper reports the highest matching performance ever reported in undoped ultra-thin FDSOI MOSFETs. The fifth paper identifies the various components in the Vth variability for thin BOX CMOS devices. The sixth paper is an invited paper focused on the prospects of velocity enhancement and the outlooks for novel channel materials such as Ge and III-V. The seventh paper proposes new effective drive current methodologies to predict performance consistently across wide Vth range.
Keywords
CMOS technology; FinFETs; Guidelines; High K dielectric materials; High-K gate dielectrics; III-V semiconductor materials; Instruments; MOSFETs; Random access memory;
fLanguage
English
Publisher
ieee
Conference_Titel
Electron Devices Meeting, 2008. IEDM 2008. IEEE International
Conference_Location
San Francisco, CA, USA
ISSN
8164-2284
Print_ISBN
978-1-4244-2377-4
Electronic_ISBN
8164-2284
Type
conf
DOI
10.1109/IEDM.2008.4796659
Filename
4796659
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