• DocumentCode
    2929101
  • Title

    Reliability analysis of microwave GaAs/AlGaAs HBTs with beryllium and carbon doped base

  • Author

    Yamada, F.M. ; Oki, A.K. ; Streit, D.C. ; Saito, Y. ; Umemoto, D.K. ; Tran, L.T. ; Bui, S. ; Velebir, J.R. ; McIver, G.W.

  • Author_Institution
    TRW Inc., Redondo Beach, CA, USA
  • fYear
    1992
  • fDate
    1-5 June 1992
  • Firstpage
    739
  • Abstract
    The reliability characteristics of microwave GaAs/AlGaAs negative-positive-negative (NPN) heterojunction bipolar transistors (HBTs) with beryllium (Be) and carbon (C) doped base layer have been investigated and compared by means of constant stress lifetest. Three groups of Be-doped devices using a newly developed molecular beam epitaxy (MBE) profile exhibited a median-time-to-failure (MTTF) of up to 1.8*10/sup 8/ hours at 125 degrees C junction temperature based on the lifetest characteristics of DC current gain, beta . The C-doped devices displayed a MTTF of 4.2*10/sup 5/ h under the same conditions. An equivalent failure rate of <0.1 FITs and 119 FITs at 10/sup 5/ h were calculated for Be and C doped devices, respectively.<>
  • Keywords
    III-V semiconductors; aluminium compounds; gallium arsenide; heterojunction bipolar transistors; life testing; molecular beam epitaxial growth; reliability; semiconductor device testing; semiconductor epitaxial layers; solid-state microwave devices; 125 degC; DC current gain; GaAs-AlGaAs; III-V semiconductors; MTTF; constant stress lifetest; equivalent failure rate; median-time-to-failure; microwave devices; molecular beam epitaxy; npn HBTs; reliability characteristics; Gallium arsenide; Heterojunction bipolar transistors; MOCVD; Microwave devices; Molecular beam epitaxial growth; Silicon; Space technology; Stress; Substrates; Temperature;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microwave Symposium Digest, 1992., IEEE MTT-S International
  • Conference_Location
    Albuquerque, NM, USA
  • ISSN
    0149-645X
  • Print_ISBN
    0-7803-0611-2
  • Type

    conf

  • DOI
    10.1109/MWSYM.1992.188091
  • Filename
    188091