DocumentCode :
2929194
Title :
Wireless-compatible optics-free microarray imager
Author :
Anwar, Mekhail ; Aytur, Turgut ; Matsudaira, Paul
Author_Institution :
Dept. of Electr. Eng. & Comput. Sci., Massachusetts Inst. of Technol., Cambridge, MA
fYear :
2008
fDate :
15-17 Dec. 2008
Firstpage :
1
Lastpage :
4
Abstract :
We describe a low-cost, wireless compatible biosensor for optical microarray based applications. With the increasing use of microarray platforms in biosensors, as well as high-throughput screening in the areas of research and diagnostics, it has become necessary to develop a low cost imager compatible with existing mu array platforms, enabling microarray technology to be widely utilized outside of a laboratory setting. The incorporation of a wireless interface enables the possibility of a package-free biosensor for direct integration into biological environments. To accomplish this we developed an imaging platform using a standard digital CMOS process that allows direct integration of electronics, while levering the optical properties of silicon photodiodes and quantum dots to eliminate the need for optical filters and lenses, enabling a low-cost integrated solution. As a proof of concept, we demonstrate the detection of a 20 nM concentration of streptavidin without the use of optics.
Keywords :
CMOS digital integrated circuits; CMOS image sensors; biochemistry; biosensors; lab-on-a-chip; molecular biophysics; optical sensors; proteins; digital CMOS process; low-cost integrated solution; microarray imager; mu array platform; optics-free optical biosensor; package-free biosensor; quantum dots; silicon photodiode; streptavidin; wireless compatible biosensor; wireless interface; Biomedical optical imaging; Biosensors; CMOS process; CMOS technology; Costs; Electronics packaging; Laboratories; Optical filters; Optical imaging; Standards development;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electron Devices Meeting, 2008. IEDM 2008. IEEE International
Conference_Location :
San Francisco, CA
ISSN :
8164-2284
Print_ISBN :
978-1-4244-2377-4
Electronic_ISBN :
8164-2284
Type :
conf
DOI :
10.1109/IEDM.2008.4796672
Filename :
4796672
Link To Document :
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