DocumentCode
2929499
Title
ESD qualification changes for 45nm and beyond
Author
Duvvury, Charvaka
Author_Institution
Texas Instrum. Inc., Dallas, TX
fYear
2008
fDate
15-17 Dec. 2008
Firstpage
1
Lastpage
4
Abstract
As the silicon technologies advance further into sub-50 nm feature sizes, the circuit demands for high-speed operation are continually making ESD into a challenging issue. This paper reviews the current perception about ESD and why there must be an immediate paradigm shift for the ESD qualification requirements.
Keywords
electrostatic discharge; radiation hardening (electronics); semiconductor technology; ESD qualification changes; silicon technology; size 45 nm; Breakdown voltage; Capacitance; Current density; Degradation; Electrostatic discharge; Integrated circuit interconnections; Integrated circuit modeling; Protection; Qualifications; Silicon;
fLanguage
English
Publisher
ieee
Conference_Titel
Electron Devices Meeting, 2008. IEDM 2008. IEEE International
Conference_Location
San Francisco, CA
ISSN
8164-2284
Print_ISBN
978-1-4244-2377-4
Electronic_ISBN
8164-2284
Type
conf
DOI
10.1109/IEDM.2008.4796688
Filename
4796688
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