• DocumentCode
    2929636
  • Title

    Addressing the gate stack challenge for high mobility InxGa1-xAs channels for NFETs

  • Author

    Goel, N. ; Heh, D. ; Koveshnikov, S. ; Ok, I. ; Oktyabrsky, S. ; Tokranov, V. ; Kambhampatic, R. ; Yakimov, M. ; Sun, Y. ; Pianetta, P. ; Gaspe, C.K. ; Santos, M.B. ; Lee, J. ; Datta, Soupayan ; Majhi, P. ; Tsa, W.

  • Author_Institution
    Intel, Santa Clara, CA
  • fYear
    2008
  • fDate
    15-17 Dec. 2008
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    Through a detailed evaluation of various dielectrics, we address the primary challenges associated with gate stacks on high electron mobility InGaAs channels. More specifically we address key gate stack issues including a) EOT scalability for high performance and electrostatic control (this work CET ~0.78 nm) with acceptable leakage both at operating and offstate for low power (this work Jg ~1 A/cm2), b) understand source and impact of charge trapping, c) thermal stability on InGaAs, and d) impact of In% on interface structure and its impact on surface channel MOSFETs.
  • Keywords
    III-V semiconductors; MOSFET; atomic layer deposition; dielectric materials; gallium arsenide; high electron mobility transistors; indium compounds; low-power electronics; thermal analysis; thermal stability; ALD deposition; EOT scalability; InGaAs; NFET; electrostatic control; gate stack challenge; high electron mobility channels; interface structure; low power operation; surface channel MOSFET; thermal stability; Cleaning; Dielectric substrates; Electrostatics; Frequency; Hafnium; Hysteresis; III-V semiconductor materials; Indium gallium arsenide; MOSFETs; Scalability;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electron Devices Meeting, 2008. IEDM 2008. IEEE International
  • Conference_Location
    San Francisco, CA
  • ISSN
    8164-2284
  • Print_ISBN
    978-1-4244-2377-4
  • Electronic_ISBN
    8164-2284
  • Type

    conf

  • DOI
    10.1109/IEDM.2008.4796695
  • Filename
    4796695