DocumentCode
2929636
Title
Addressing the gate stack challenge for high mobility Inx Ga1-x As channels for NFETs
Author
Goel, N. ; Heh, D. ; Koveshnikov, S. ; Ok, I. ; Oktyabrsky, S. ; Tokranov, V. ; Kambhampatic, R. ; Yakimov, M. ; Sun, Y. ; Pianetta, P. ; Gaspe, C.K. ; Santos, M.B. ; Lee, J. ; Datta, Soupayan ; Majhi, P. ; Tsa, W.
Author_Institution
Intel, Santa Clara, CA
fYear
2008
fDate
15-17 Dec. 2008
Firstpage
1
Lastpage
4
Abstract
Through a detailed evaluation of various dielectrics, we address the primary challenges associated with gate stacks on high electron mobility InGaAs channels. More specifically we address key gate stack issues including a) EOT scalability for high performance and electrostatic control (this work CET ~0.78 nm) with acceptable leakage both at operating and offstate for low power (this work Jg ~1 A/cm2), b) understand source and impact of charge trapping, c) thermal stability on InGaAs, and d) impact of In% on interface structure and its impact on surface channel MOSFETs.
Keywords
III-V semiconductors; MOSFET; atomic layer deposition; dielectric materials; gallium arsenide; high electron mobility transistors; indium compounds; low-power electronics; thermal analysis; thermal stability; ALD deposition; EOT scalability; InGaAs; NFET; electrostatic control; gate stack challenge; high electron mobility channels; interface structure; low power operation; surface channel MOSFET; thermal stability; Cleaning; Dielectric substrates; Electrostatics; Frequency; Hafnium; Hysteresis; III-V semiconductor materials; Indium gallium arsenide; MOSFETs; Scalability;
fLanguage
English
Publisher
ieee
Conference_Titel
Electron Devices Meeting, 2008. IEDM 2008. IEEE International
Conference_Location
San Francisco, CA
ISSN
8164-2284
Print_ISBN
978-1-4244-2377-4
Electronic_ISBN
8164-2284
Type
conf
DOI
10.1109/IEDM.2008.4796695
Filename
4796695
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