DocumentCode :
2929636
Title :
Addressing the gate stack challenge for high mobility InxGa1-xAs channels for NFETs
Author :
Goel, N. ; Heh, D. ; Koveshnikov, S. ; Ok, I. ; Oktyabrsky, S. ; Tokranov, V. ; Kambhampatic, R. ; Yakimov, M. ; Sun, Y. ; Pianetta, P. ; Gaspe, C.K. ; Santos, M.B. ; Lee, J. ; Datta, Soupayan ; Majhi, P. ; Tsa, W.
Author_Institution :
Intel, Santa Clara, CA
fYear :
2008
fDate :
15-17 Dec. 2008
Firstpage :
1
Lastpage :
4
Abstract :
Through a detailed evaluation of various dielectrics, we address the primary challenges associated with gate stacks on high electron mobility InGaAs channels. More specifically we address key gate stack issues including a) EOT scalability for high performance and electrostatic control (this work CET ~0.78 nm) with acceptable leakage both at operating and offstate for low power (this work Jg ~1 A/cm2), b) understand source and impact of charge trapping, c) thermal stability on InGaAs, and d) impact of In% on interface structure and its impact on surface channel MOSFETs.
Keywords :
III-V semiconductors; MOSFET; atomic layer deposition; dielectric materials; gallium arsenide; high electron mobility transistors; indium compounds; low-power electronics; thermal analysis; thermal stability; ALD deposition; EOT scalability; InGaAs; NFET; electrostatic control; gate stack challenge; high electron mobility channels; interface structure; low power operation; surface channel MOSFET; thermal stability; Cleaning; Dielectric substrates; Electrostatics; Frequency; Hafnium; Hysteresis; III-V semiconductor materials; Indium gallium arsenide; MOSFETs; Scalability;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electron Devices Meeting, 2008. IEDM 2008. IEEE International
Conference_Location :
San Francisco, CA
ISSN :
8164-2284
Print_ISBN :
978-1-4244-2377-4
Electronic_ISBN :
8164-2284
Type :
conf
DOI :
10.1109/IEDM.2008.4796695
Filename :
4796695
Link To Document :
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