DocumentCode
2929679
Title
Thermal heating of a retinal prosthesis: Thermal model and in-vitro study
Author
Opie, Nicholas L. ; Burkitt, Anthony N. ; Meffin, Hamish ; Grayden, David B.
Author_Institution
Dept. of Electr. Eng., Univ. of Melbourne, Melbourne, VIC, Australia
fYear
2010
fDate
Aug. 31 2010-Sept. 4 2010
Firstpage
1597
Lastpage
1600
Abstract
In order to develop retinal implants with a large number of electrodes, it is necessary to ensure that they do not cause damage to the neural tissue by the heat that the electrical circuits generate. Knowledge about the threshold of the amount of power that induces thermal damage will greatly assist in development of power budgets for implants, which has a significant effect upon the design of implant circuitry. In this study, we developed and tested in-vitro equipment that can dissipate thermal energy in current prosthesis implantation sites while simultaneously measuring and recording temperature distributions at multiple locations along the retinal tissue. A finite element thermal model of the feline eye was also created and validated by the in-vitro tests allowing for a much larger spectrum of thermal influences to be evaluated without the additional cost of animal sacrifice.
Keywords
biological tissues; biomedical electrodes; biothermics; eye; finite element analysis; heating; neurophysiology; physiological models; prosthetics; temperature distribution; electrodes; feline eye; finite element thermal model; implant circuitry; implants; neural tissue; retinal tissue; temperature distributions; thermal damage; thermal energy; thermal heating; Conductivity; Finite element methods; Heating; Implants; Retina; Temperature measurement; Thermal conductivity; Body Temperature; Computer Simulation; Computer-Aided Design; Equipment Design; Equipment Failure Analysis; Heating; Humans; Models, Biological; Retina; Visual Prosthesis;
fLanguage
English
Publisher
ieee
Conference_Titel
Engineering in Medicine and Biology Society (EMBC), 2010 Annual International Conference of the IEEE
Conference_Location
Buenos Aires
ISSN
1557-170X
Print_ISBN
978-1-4244-4123-5
Type
conf
DOI
10.1109/IEMBS.2010.5626670
Filename
5626670
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