Title :
Technology-circuit collaboration for low-power LSI´s
Author :
Sakurai, Takayasu
Author_Institution :
Inst. of Ind. Sci., Univ. of Tokyo, Tokyo
Abstract :
There are two recent trends in achieving low-power LSI systems. One is to explore 3D integration and the other is to pursue deep sub-volt domain. Technology-circuit collaboration is necessary to fully enjoy the promise of both approaches.
Keywords :
integrated circuit design; large scale integration; low-power electronics; 3D integration; deep sub-volt domain integration; large scale integration; low-power LSI; technology-circuit collaboration; ultralow-voltage digital design; CMOS logic circuits; Collaboration; Integrated circuit technology; Large scale integration; Mathematical model; Power measurement; Thickness measurement; Through-silicon vias; Voltage measurement; Voltage-controlled oscillators;
Conference_Titel :
Electron Devices Meeting, 2008. IEDM 2008. IEEE International
Conference_Location :
San Francisco, CA
Print_ISBN :
978-1-4244-2377-4
Electronic_ISBN :
8164-2284
DOI :
10.1109/IEDM.2008.4796709
