An equivalent circuit model of a plated-through-hole interconnect for multilayer stripline circuits

An empirically based equivalent circuit model of a plated-through-hole interconnect for multilayer stripline circuits is presented. The model, a distributed network of lumped components whose values are functions of the geometry of the interconnect, was based on the time-domain analysis of extensive empirical data. The measured data were taken from a multilayer stripline test fixture containing 132 different interconnect architectures. The model provides an accurate characterization of the interconnect impedance from 0.045 to approximately 14 GHz. General design guidelines, based on observations of the physical range of configurations studied, are also presented.<>