Title :
Full-wave analysis of 3D metallization structures using a spectral domain technique
Author :
Becks, T. ; Wolff, I.
Author_Institution :
Dept. of Electr. Eng., Duisburg Univ., Germany
Abstract :
A full-wave method for the investigation of microstrip- and coplanar-structures including 3-D metallization structures is presented. The spectral domain analysis method was used to calculate the S-parameters of unshielded microwave components containing bond-wires and air-bridges. The general formulation and the method are described. The application of the theory is outlined by a comparison of measured and calculated results for a spiral inductor.<>
Keywords :
S-parameters; metallisation; microstrip lines; spectral-domain analysis; waveguide theory; 3D metallization structures; S-parameters; air-bridges; bond-wires; coplanar-structures; full-wave method; microstrip structures; spectral domain technique; spiral inductor; unshielded microwave components; Bonding; Bridges; Circuits; Current density; Equations; Iterative methods; Metallization; Microwave theory and techniques; Scattering parameters; Spectral analysis;
Conference_Titel :
Microwave Symposium Digest, 1992., IEEE MTT-S International
Conference_Location :
Albuquerque, NM, USA
Print_ISBN :
0-7803-0611-2
DOI :
10.1109/MWSYM.1992.188191
