Title :
Removing package effects from microstrip moment method calculations
Author_Institution :
Dept. of Electr. & Comput. Eng., Massachusetts Univ., Amherst, MA, USA
Abstract :
The electromagnetic behavior of microstrip circuits often depends on the package that surrounds the circuit. This is especially true if the package is electrically large. The importance of a damped enclosure for modeling and operating MMIC (monolithic microwave IC) circuits is discussed, a method of damping enclosures is presented, and an efficient technique for applying the method of moments so as to determine the significance of the package effects on full-wave simulations is outlined.<>
Keywords :
MMIC; microstrip components; packaging; MMIC; damped enclosure; electromagnetic behavior; full-wave simulations; microstrip circuits; modeling; moment method calculations; monolithic microwave IC; Circuit simulation; Damping; Integrated circuit modeling; Integrated circuit packaging; MMICs; Microstrip; Microwave integrated circuits; Microwave theory and techniques; Moment methods; Monolithic integrated circuits;
Conference_Titel :
Microwave Symposium Digest, 1992., IEEE MTT-S International
Conference_Location :
Albuquerque, NM, USA
Print_ISBN :
0-7803-0611-2
DOI :
10.1109/MWSYM.1992.188220
