DocumentCode
2931117
Title
Full-wave modeling of via hole grounds in microstrip by three-dimensional mode matching technique
Author
Alessandri, F. ; Mongiardo, M. ; Sorrentino, R.
Author_Institution
Microdesign Sas, Rome, Italy
fYear
1992
fDate
1-5 June 1992
Firstpage
1237
Abstract
A rigorous full-wave analysis of microstrip via hole grounds is performed using a three-dimensional mode-matching method by means of a suitable segmentation technique. Theoretical results are compared with measured data, showing an excellent agreement. Comparisons with available approximate methods have also been made to exploit their limits of validity.<>
Keywords
MMIC; microstrip lines; microwave integrated circuits; waveguide theory; MIC; MMIC; full-wave analysis; microstrip; segmentation technique; three-dimensional mode matching; via hole grounds; Magnetic analysis; Magnetic fields; Magnetic separation; Microstrip; Planar waveguides; Printed circuits; Rectangular waveguides; Region 1; Strips; Waveguide discontinuities;
fLanguage
English
Publisher
ieee
Conference_Titel
Microwave Symposium Digest, 1992., IEEE MTT-S International
Conference_Location
Albuquerque, NM, USA
ISSN
0149-645X
Print_ISBN
0-7803-0611-2
Type
conf
DOI
10.1109/MWSYM.1992.188223
Filename
188223
Link To Document