• DocumentCode
    2931216
  • Title

    A 45nm low power system-on-chip technology with dual gate (logic and I/O) high-k/metal gate strained silicon transistors

  • Author

    Jan, C.-H. ; Bai, P. ; Biswas, S. ; Buehler, M. ; Chen, Z.-P. ; Curello, G. ; Gannavaram, S. ; Hafez, W. ; He, J. ; Hicks, J. ; Jalan, U. ; Lazo, N. ; Lin, J. ; Lindert, N. ; Litteken, C. ; Jones, M. ; Kang, M. ; Komeyli, K. ; Mezhiba, A. ; Naskar, S. ; O

  • Author_Institution
    Logic Technol. Dev., Intel Corp., Hillsboro, OR
  • fYear
    2008
  • fDate
    15-17 Dec. 2008
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    A leading edge 45 nm CMOS system-on-chip (SOC) technology using Hafnium-based high-k/metal gate transistors has been optimized for low power products. PMOS/NMOS logic transistor drive currents of 0.86/1.08 mA/um, respectively, have been achieved at 1.1 V and off-state leakage of 1 nA/um. Record RF performance for a mainstream 45 nm bulk CMOS technology has been achieved with measured fT/fMAX values of 395 GHz/410 GHz for NMOS and 300 GHz/325 GHz for PMOS with 28 nm Lgate transistors. HV I/O transistors with robust reliability and other SOC features, including linear resistors, MIS and MIM capacitors, varactors, inductors, vertical BJTs, precision diodes and high density OTP fuses are employed for HV I/O, analog and RF circuit integration.
  • Keywords
    MOSFET; system-on-chip; CMOS system-on-chip technology; PMOS-NMOS logic transistor drive currents; dual gate high-k-metal gate strained silicon transistors; frequency 300 GHz; frequency 410 GHz; low power system-on-chip technology; size 45 nm; voltage 1.1 V; CMOS logic circuits; CMOS technology; High K dielectric materials; High-K gate dielectrics; Logic gates; MOS devices; Power systems; Radio frequency; Silicon; System-on-a-chip;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electron Devices Meeting, 2008. IEDM 2008. IEEE International
  • Conference_Location
    San Francisco, CA
  • ISSN
    8164-2284
  • Print_ISBN
    978-1-4244-2377-4
  • Electronic_ISBN
    8164-2284
  • Type

    conf

  • DOI
    10.1109/IEDM.2008.4796772
  • Filename
    4796772