DocumentCode :
2932117
Title :
Trap Spectroscopy by Charge Injection and Sensing (TSCIS): A quantitative electrical technique for studying defects in dielectric stacks
Author :
Degraeve, R. ; Cho, M. ; Govoreanu, B. ; Kaczer, B. ; Zahid, M.B. ; Van Houdt, J. ; Jurczak, M. ; Groeseneken, G.
Author_Institution :
IMEC, Leuven
fYear :
2008
fDate :
15-17 Dec. 2008
Firstpage :
1
Lastpage :
4
Abstract :
Trap spectroscopy by charge injection and sensing (TSCIS) is a new, fast and powerful material analysis technique that provides detailed information on the trap density profile and trap energy level in dielectric materials. We show the measurement principle and explain the data analysis. The technique is applied to a number of example materials: SiO2, Al2O3, and Si3N4. We show that TSCIS has excellent resolution and is capable of distinguishing between different process-variations.
Keywords :
VLSI; aluminium compounds; dielectric materials; semiconductor materials; silicon compounds; spectra; charge injection and sensing; dielectric stacks; material analysis technique; process-variations; quantitative electrical technique; trap density profile; trap energy level; trap spectroscopy; Aluminum oxide; Charge measurement; Current measurement; Dielectric materials; Dielectric measurements; Electrochemical impedance spectroscopy; Energy states; High K dielectric materials; MOSFETs; Tunneling;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electron Devices Meeting, 2008. IEDM 2008. IEEE International
Conference_Location :
San Francisco, CA
ISSN :
8164-2284
Print_ISBN :
978-1-4244-2377-4
Electronic_ISBN :
8164-2284
Type :
conf
DOI :
10.1109/IEDM.2008.4796812
Filename :
4796812
Link To Document :
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