DocumentCode
2932127
Title
The chemistry of gate dielectric breakdown
Author
Li, X. ; Tung, C.H. ; Pey, K.L. ; Lo, V.L.
Author_Institution
Sch. of EEE, Nanyang Technol. Univ., Singapore
fYear
2008
fDate
15-17 Dec. 2008
Firstpage
1
Lastpage
4
Abstract
Using scanning transmission electron microscope with high resolution electron energy loss spectroscopy, the chemical nature of the percolation path formed in ultrathin SiON layers is studied for digital and analog breakdown (BD). Our results show that the diameter of the percolation path dilates from 30 nm to 55 nm as the gate leakage current increases from 2 muA to 40 muA. Oxygen deficiency in the percolation path is radially distributed from the BD path center to its surrounding areas. The chemical composition in the center of percolation path changes from SiO1.3 to SiO1.0 as the BD path evolves from digital to analog BD.
Keywords
electric breakdown; electron spectroscopy; scanning electron microscopes; silicon compounds; SiO; gate dielectric breakdown; gate leakage current; resolution electron energy loss spectroscopy; scanning transmission electron microscope; ultrathin SiON layers; Chemicals; Chemistry; Dielectric breakdown; Electric breakdown; Energy loss; Energy resolution; Leakage current; Scanning electron microscopy; Spectroscopy; Transmission electron microscopy;
fLanguage
English
Publisher
ieee
Conference_Titel
Electron Devices Meeting, 2008. IEDM 2008. IEEE International
Conference_Location
San Francisco, CA
ISSN
8164-2284
Print_ISBN
978-1-4244-2377-4
Electronic_ISBN
8164-2284
Type
conf
DOI
10.1109/IEDM.2008.4796813
Filename
4796813
Link To Document