• DocumentCode
    2932127
  • Title

    The chemistry of gate dielectric breakdown

  • Author

    Li, X. ; Tung, C.H. ; Pey, K.L. ; Lo, V.L.

  • Author_Institution
    Sch. of EEE, Nanyang Technol. Univ., Singapore
  • fYear
    2008
  • fDate
    15-17 Dec. 2008
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    Using scanning transmission electron microscope with high resolution electron energy loss spectroscopy, the chemical nature of the percolation path formed in ultrathin SiON layers is studied for digital and analog breakdown (BD). Our results show that the diameter of the percolation path dilates from 30 nm to 55 nm as the gate leakage current increases from 2 muA to 40 muA. Oxygen deficiency in the percolation path is radially distributed from the BD path center to its surrounding areas. The chemical composition in the center of percolation path changes from SiO1.3 to SiO1.0 as the BD path evolves from digital to analog BD.
  • Keywords
    electric breakdown; electron spectroscopy; scanning electron microscopes; silicon compounds; SiO; gate dielectric breakdown; gate leakage current; resolution electron energy loss spectroscopy; scanning transmission electron microscope; ultrathin SiON layers; Chemicals; Chemistry; Dielectric breakdown; Electric breakdown; Energy loss; Energy resolution; Leakage current; Scanning electron microscopy; Spectroscopy; Transmission electron microscopy;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electron Devices Meeting, 2008. IEDM 2008. IEEE International
  • Conference_Location
    San Francisco, CA
  • ISSN
    8164-2284
  • Print_ISBN
    978-1-4244-2377-4
  • Electronic_ISBN
    8164-2284
  • Type

    conf

  • DOI
    10.1109/IEDM.2008.4796813
  • Filename
    4796813