DocumentCode
2932198
Title
Packaging requirements for high volume wireless communications
Author
Green, D.R. ; Beccone, J.P. ; Crispell, R.B.
Author_Institution
AT&T Bell Lab., Reading, PA, USA
fYear
1992
fDate
1-5 June 1992
Abstract
Summary form only given. The authors presented an overview of present and anticipated high-volume wireless communication applications, with emphasis on cellular and cordless phones, for MMICs (monolithic microwave integrated circuits) and MICs. The packaging requirements are discussed for existing and emerging standards.<>
Keywords
MMIC; cellular radio; cordless telephone systems; microwave integrated circuits; packaging; radio equipment; MICs; MMICs; cordless phones; high volume wireless communications; monolithic microwave integrated circuits; packaging requirements; Cellular phones; MMICs; Microwave integrated circuits; Packaging; Personal communication networks; Power amplifiers; Radiofrequency amplifiers; Thermal management; Wireless LAN; Wireless communication;
fLanguage
English
Publisher
ieee
Conference_Titel
Microwave Symposium Digest, 1992., IEEE MTT-S International
Conference_Location
Albuquerque, NM, USA
ISSN
0149-645X
Print_ISBN
0-7803-0611-2
Type
conf
DOI
10.1109/MWSYM.1992.188297
Filename
188297
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