Title :
Packaging requirements for high volume wireless communications
Author :
Green, D.R. ; Beccone, J.P. ; Crispell, R.B.
Author_Institution :
AT&T Bell Lab., Reading, PA, USA
Abstract :
Summary form only given. The authors presented an overview of present and anticipated high-volume wireless communication applications, with emphasis on cellular and cordless phones, for MMICs (monolithic microwave integrated circuits) and MICs. The packaging requirements are discussed for existing and emerging standards.<>
Keywords :
MMIC; cellular radio; cordless telephone systems; microwave integrated circuits; packaging; radio equipment; MICs; MMICs; cordless phones; high volume wireless communications; monolithic microwave integrated circuits; packaging requirements; Cellular phones; MMICs; Microwave integrated circuits; Packaging; Personal communication networks; Power amplifiers; Radiofrequency amplifiers; Thermal management; Wireless LAN; Wireless communication;
Conference_Titel :
Microwave Symposium Digest, 1992., IEEE MTT-S International
Conference_Location :
Albuquerque, NM, USA
Print_ISBN :
0-7803-0611-2
DOI :
10.1109/MWSYM.1992.188297
