Title :
Microwave module packaging
Author :
Jerinic, G. ; Borkowski, M.
Author_Institution :
Raytheon Co., Tewksbury, MA, USA
Abstract :
The demonstration of a $50 package for GaAs MMIC (monolithic microwave integrated circuit) microwave module applications has not been achieved yet. The authors outline the requirements for microwave packaging and describe three low-cost metal-package solutions: (1) brazed construction, (2) metal injection molded construction, and (3) pressure infiltration casting. It is concluded that housing costs that are less than $50 for large quantities can be achieved. If minimum weight is not an essential requirement, a 10-20% cost savings appears to be possible.<>
Keywords :
III-V semiconductors; MMIC; gallium arsenide; integrated circuit technology; modules; packaging; GaAs; MMIC; brazed construction; housing costs; low-cost metal-package; metal injection molded construction; microwave packaging; module packaging; monolithic microwave integrated circuit; pressure infiltration casting; Assembly; Conducting materials; Costs; Electromagnetic heating; Electronic packaging thermal management; Gallium arsenide; MMICs; Microwave devices; Temperature; Thermal conductivity;
Conference_Titel :
Microwave Symposium Digest, 1992., IEEE MTT-S International
Conference_Location :
Albuquerque, NM, USA
Print_ISBN :
0-7803-0611-2
DOI :
10.1109/MWSYM.1992.188298
