• DocumentCode
    2932626
  • Title

    Double-Gate Strained-Ge Heterostructure Tunneling FET (TFET) With record high drive currents and ≪60mV/dec subthreshold slope

  • Author

    Krishnamohan, Tejas ; Kim, Donghyun ; Raghunathan, Shyam ; Saraswat, Krishna

  • Author_Institution
    Stanford Univ., Stanford, CA
  • fYear
    2008
  • fDate
    15-17 Dec. 2008
  • Firstpage
    1
  • Lastpage
    3
  • Abstract
    The main challenges for Tunnel FETs are experimentally demonstrating SS<60 mV/dec, high ON currents and solving their ambipolar behavior. We have experimentally demonstrated a Double-Gate, Strained-Ge, Heterostructure Tunneling FET (TFET) exhibiting very high drive currents and SS<60 mV/dec. Due to small bandgap of s-Ge and the electrostatics of the DG structure, record high drive current of 300 uA/um (the highest ever reported experimentally for a TFET) and a subthreshold slope of ~50 mV/dec was observed. In addition, to address the ambipolar problem and examine the scalability of TFETs, we have developed a sophisticated TFET simulator that uses a Quantum transport model, Non-local BTBT, complete Bandstructure (real and complex) information, and includes all transitions (direct and phonon assisted). Using this simulator, we have studied the scalability of three asymmetric DG TFET configurations (underlapped drain, lower drain doping and lateral heterostructure) in terms of their ability to solve the ambipolar behavior and achieve high ON and low OFF currents.
  • Keywords
    MOSFET; electrostatics; germanium; high electron mobility transistors; ambipolar behavior; bandstructure information; double-gate strained-Ge heterostructure tunneling FET; electrostatics; nonlocal BTBT; quantum transport model; Doping; Double-gate FETs; Electrical resistance measurement; Electrostatics; MOSFETs; Phonons; Photonic band gap; Scalability; Tunneling; Voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electron Devices Meeting, 2008. IEDM 2008. IEEE International
  • Conference_Location
    San Francisco, CA
  • ISSN
    8164-2284
  • Print_ISBN
    978-1-4244-2377-4
  • Electronic_ISBN
    8164-2284
  • Type

    conf

  • DOI
    10.1109/IEDM.2008.4796839
  • Filename
    4796839