Development of underfill material with high valued performance

Flip chip packages are one of the most important devices in the semiconductor area. Currently, in order to reduce process costs, shorter cycle time for assembly of flip chip package is required. For this purpose, we studied underfill materials with short cure properties. In this report, we confirmed that both good adhesion, even after humidity treatment, and no voiding after cure resulted in good reliability. In addition, we found that the catalyst structure with polar groups and a suitable distribution of filler were important for a shorter cure property