DocumentCode
2932970
Title
Functional regeneration of severed peripheral nerve using an implantable electrical stimulator
Author
Lee, Tae Hyung ; Pan, Hui ; Kim, In Sook ; Hwang, Soon Jung ; Kim, Sung June
Author_Institution
Sch. of Electr. Eng. & Comput. Sci., Seoul Nat. Univ., Seoul, South Korea
fYear
2010
fDate
Aug. 31 2010-Sept. 4 2010
Firstpage
1511
Lastpage
1514
Abstract
This paper presents functional regeneration of severed peripheral nerve using a polymer-based implantable electrical stimulator. A polyimide based conduit electrode was made by micro-fabrication and a stimulation chip was designed to generate biphasic current pulse for electrical stimulation. The stimulation chip was packaged with a battery using silicone elastomer, and integrated with the electrode. The implantable electrical stimulator was implanted in the rat sciatic nerve with 7 mm gap. The electrical stimulation was applied for periods of one, two and four weeks between the proximal and the distal nerve stumps. After four weeks of post-operations, the degree of regeneration was evaluated through walking track assessments and by measuring neural response of the regenerated nerve. Based on these results, electrical stimulation, especially for two weeks of stimulation, could accelerate functional regeneration of the severed nerve.
Keywords
bioelectric phenomena; biomedical electrodes; neuromuscular stimulation; polymers; prosthetics; battery; biphasic current pulse; functional regeneration; neural response; polyimide based conduit electrode; polymer-based implantable electrical stimulator; rat sciatic nerve; severed peripheral nerve; silicone elastomer; walking track assessments; Electrical stimulation; Electrodes; Injuries; Legged locomotion; Polyimides; Rats; Animals; Electric Power Supplies; Electric Stimulation Therapy; Nerve Regeneration; Prostheses and Implants; Rats; Recovery of Function; Sciatic Neuropathy;
fLanguage
English
Publisher
ieee
Conference_Titel
Engineering in Medicine and Biology Society (EMBC), 2010 Annual International Conference of the IEEE
Conference_Location
Buenos Aires
ISSN
1557-170X
Print_ISBN
978-1-4244-4123-5
Type
conf
DOI
10.1109/IEMBS.2010.5626837
Filename
5626837
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