Full-duplex transceiver-PIC fabricated by using three MOVPE growth steps

Author

Hamacher, M. ; Trommer, D. ; Heidrich, H.

Author_Institution

Heinrich-Hertz-Inst. fur Nachrichtentech. Berlin GmbH, Germany

fYear

1996

fDate

25 Feb.-1 March 1996

Firstpage

65

Lastpage

66

Abstract

Summary form only given. For future photonic communications systems low-cost optoelectronic-integrated circuits are indispensable. These photonic ICs should have an ultrahigh capacity and should offer a maximum of flexibility in device architecture. High performance and high reliability are a must for the economic implementation. Based on our experiences in the fabrication of a polarization diversity heterodyne receiver we present here an improved, cost-effective, and versatile integration PIC process with reduced epitaxial growth steps.

Keywords

demodulation; integrated optoelectronics; optical fabrication; optical receivers; semiconductor growth; transceivers; vapour phase epitaxial growth; MOVPE growth steps; cost-effective; device architecture; economic implementation; full-duplex transceiver-PIC fabrication; high reliability; low-cost optoelectronic-integrated circuits; photonic ICs; photonic communications systems; polarization diversity heterodyne receiver; reduced epitaxial growth steps; ultrahigh capacity; versatile integration PIC process; Couplers; Distributed feedback devices; Epitaxial growth; Epitaxial layers; Frequency; Optical device fabrication; Optical receivers; Optical transmitters; Optical waveguides; Waveguide lasers;

fLanguage

English

Publisher

ieee

Conference_Titel

Optical Fiber Communications, 1996. OFC '96

Print_ISBN

1-55752-422-X

Type

conf

DOI

10.1109/OFC.1996.907647

Filename

907647