DocumentCode :
2934382
Title :
Implmentation of digital audio effect SoC
Author :
Byun, Kyungjin ; Kwon, Young-Su ; Koo, Bon-tae ; Eum, Nak-Woong ; Jeong, Koang-Hui ; Koo, Jae-Eul
Author_Institution :
Electron. & Telecommun. Res. Inst. (ETRI), Daejeon, South Korea
fYear :
2009
fDate :
June 28 2009-July 3 2009
Firstpage :
1194
Lastpage :
1197
Abstract :
This paper describes the implementation of digital audio effect SoC (system on chip) which integrates the embedded DSP core, audio codec IP, a number of peripheral blocks and various audio effect algorithms. The audio effect SoC is developed by a software and hardware co-design method. The embedded DSP and some dedicated hardware blocks are developed as a hardware design while the audio effect algorithms are realized by a software centric way. In the implementation of audio effects, we employ the primitive functions of the embedded DSP compiler which provide the efficient way to implement the audio effect algorithms. Most of the algorithms are implemented by C language with the primitive functions and they are run on the embedded DSP while the equalizer which requires a large amount of computing power is implemented by the dedicated hardware block with high flexibility. The audio effect SoC was fabricated by using 0.18 um CMOS process and it was evaluated successfully on the real-time test board.
Keywords :
C language; CMOS digital integrated circuits; digital signal processing chips; hardware-software codesign; system-on-chip; C language; CMOS process; audio codec IP; digital audio effect SoC; embedded DSP core; peripheral blocks; size 0.18 mum; software and hardware codesign method; software centric way; system on chip; Algorithm design and analysis; Codecs; Digital signal processing; Digital signal processing chips; Embedded computing; Embedded software; Equalizers; Hardware; Software algorithms; System-on-a-chip; DSP; Digital audio effects; SoC;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Multimedia and Expo, 2009. ICME 2009. IEEE International Conference on
Conference_Location :
New York, NY
ISSN :
1945-7871
Print_ISBN :
978-1-4244-4290-4
Electronic_ISBN :
1945-7871
Type :
conf
DOI :
10.1109/ICME.2009.5202714
Filename :
5202714
Link To Document :
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