DocumentCode
2934961
Title
Non-Fickian moisture properties characterisation and diffusion modeling for electronic packages
Author
Wong, E.H. ; Chan, K.C. ; Lim, T.B. ; Lam, T.F.
Author_Institution
Inst. of Microelectron., Singapore
fYear
1999
fDate
1999
Firstpage
302
Lastpage
306
Abstract
The rate of moisture diffusion in the IC packaging materials was found to be dependent not only on the concentration gradient as described by Fick´s Law, but also on the moisture concentration itself. This non-Fickian behaviour poses a challenge for the characterisation of moisture diffusivity of packaging materials which is conventionally based on Fick´s diffusion law. This paper presents an integrated non-linear finite element diffusion modeling and optimisation procedure that is capable of characterising moisture diffusivity as a function of moisture concentration from a single moisture sorption experiment
Keywords
diffusion; finite element analysis; integrated circuit packaging; modelling; moisture; optimisation; Fick diffusion law; IC packaging materials; concentration gradient; diffusion modeling; electronic packages; integrated nonlinear FE diffusion modeling/optimisation procedure; moisture concentration; moisture diffusivity; moisture sorption experiment; non-Fickian moisture properties characterisation; nonFickian behaviour; nonlinear finite element modeling; packaging materials; Biomembranes; Electronics packaging; Microelectronics; Moisture measurement; Performance analysis; Plastic packaging; Shape measurement; Temperature; Thermal stresses; Time measurement;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Components and Technology Conference, 1999. 1999 Proceedings. 49th
Conference_Location
San Diego, CA
ISSN
0569-5503
Print_ISBN
0-7803-5231-9
Type
conf
DOI
10.1109/ECTC.1999.776189
Filename
776189
Link To Document