• DocumentCode
    2934961
  • Title

    Non-Fickian moisture properties characterisation and diffusion modeling for electronic packages

  • Author

    Wong, E.H. ; Chan, K.C. ; Lim, T.B. ; Lam, T.F.

  • Author_Institution
    Inst. of Microelectron., Singapore
  • fYear
    1999
  • fDate
    1999
  • Firstpage
    302
  • Lastpage
    306
  • Abstract
    The rate of moisture diffusion in the IC packaging materials was found to be dependent not only on the concentration gradient as described by Fick´s Law, but also on the moisture concentration itself. This non-Fickian behaviour poses a challenge for the characterisation of moisture diffusivity of packaging materials which is conventionally based on Fick´s diffusion law. This paper presents an integrated non-linear finite element diffusion modeling and optimisation procedure that is capable of characterising moisture diffusivity as a function of moisture concentration from a single moisture sorption experiment
  • Keywords
    diffusion; finite element analysis; integrated circuit packaging; modelling; moisture; optimisation; Fick diffusion law; IC packaging materials; concentration gradient; diffusion modeling; electronic packages; integrated nonlinear FE diffusion modeling/optimisation procedure; moisture concentration; moisture diffusivity; moisture sorption experiment; non-Fickian moisture properties characterisation; nonFickian behaviour; nonlinear finite element modeling; packaging materials; Biomembranes; Electronics packaging; Microelectronics; Moisture measurement; Performance analysis; Plastic packaging; Shape measurement; Temperature; Thermal stresses; Time measurement;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Components and Technology Conference, 1999. 1999 Proceedings. 49th
  • Conference_Location
    San Diego, CA
  • ISSN
    0569-5503
  • Print_ISBN
    0-7803-5231-9
  • Type

    conf

  • DOI
    10.1109/ECTC.1999.776189
  • Filename
    776189