Title :
Mechanical stress reduction in heat sink bond layers-a numerical feasibility study
Author :
Achour, M.F.B. ; Bar-Cohen, Avram
Author_Institution :
Dept. of Mech. Eng., Minnesota Univ., Minneapolis, MN, USA
Abstract :
High interfacial thermal stresses in the adhesive layer used to bond heat sinks to chips and IC packages threaten the integrity of the bond layer and have been implicated in packaging failures, associated with both rapid delamination and progressive bond layer fatigue. It has been proposed to take advantage of a mechanical edge restraint on the heat sink base to reduce these thermal stresses and dramatically improve bond layer fatigue life. The present study explores the feasibility of this approach
Keywords :
adhesives; delamination; failure analysis; fatigue testing; heat sinks; integrated circuit packaging; thermal stresses; IC packages; adhesive layer; fatigue life; heat sink bond layers; heat sinks; interfacial thermal stresses; mechanical edge restraint; mechanical stress reduction; numerical feasibility study; packaging failures; progressive bond layer fatigue; rapid delamination; Bonding; Electronic packaging thermal management; Electronics cooling; Fatigue; Heat sinks; Microprocessors; Surface resistance; Thermal management; Thermal management of electronics; Thermal stresses;
Conference_Titel :
Electronic Components and Technology Conference, 1999. 1999 Proceedings. 49th
Conference_Location :
San Diego, CA
Print_ISBN :
0-7803-5231-9
DOI :
10.1109/ECTC.1999.776190
