Mechanical stress reduction in heat sink bond layers-a numerical feasibility study

Author

Achour, M.F.B. ; Bar-Cohen, Avram

Author_Institution

Dept. of Mech. Eng., Minnesota Univ., Minneapolis, MN, USA

fYear

1999

fDate

1999

Firstpage

307

Lastpage

315

Abstract

High interfacial thermal stresses in the adhesive layer used to bond heat sinks to chips and IC packages threaten the integrity of the bond layer and have been implicated in packaging failures, associated with both rapid delamination and progressive bond layer fatigue. It has been proposed to take advantage of a mechanical edge restraint on the heat sink base to reduce these thermal stresses and dramatically improve bond layer fatigue life. The present study explores the feasibility of this approach

Keywords

adhesives; delamination; failure analysis; fatigue testing; heat sinks; integrated circuit packaging; thermal stresses; IC packages; adhesive layer; fatigue life; heat sink bond layers; heat sinks; interfacial thermal stresses; mechanical edge restraint; mechanical stress reduction; numerical feasibility study; packaging failures; progressive bond layer fatigue; rapid delamination; Bonding; Electronic packaging thermal management; Electronics cooling; Fatigue; Heat sinks; Microprocessors; Surface resistance; Thermal management; Thermal management of electronics; Thermal stresses;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components and Technology Conference, 1999. 1999 Proceedings. 49th

Conference_Location

San Diego, CA

ISSN

0569-5503

Print_ISBN

0-7803-5231-9

Type

conf

DOI

10.1109/ECTC.1999.776190

Filename

776190