Solder column interposer for single chip ceramic packaging

Current desktop and consumer applications for microprocessors require that systems be Energy Star compliant. In addition, other power management initiatives such as Advanced Configuration and Power Interface (ACPI) define low power system states that the operating system controls. These initiatives are directed at reducing the energy consumption of desktop computer equipment during periods of inactivity as well as providing quick resumption of activity. From an electronic packaging perspective, systems will power down more often when not in use during typical conditions of daily use. Each power down cycle may result in a temperature excursion and affects the fatigue life of area array solder joints. This requirement results in the need of increased reliability of soldered surface mount ceramic packages. In this paper, we discuss a new type of ceramic package utilizing a solder column interposer to meet these reliability requirements