• DocumentCode
    2935398
  • Title

    Simulation of anisotropic artificial impedance surface with rectangular and diamond lattices

  • Author

    Quarfoth, Ryan ; Sievenpiper, Daniel

  • Author_Institution
    Electr. & Comput. Eng., Univ. of California, San Diego, San Diego, CA, USA
  • fYear
    2011
  • fDate
    3-8 July 2011
  • Firstpage
    1498
  • Lastpage
    1501
  • Abstract
    Infinite lattices of patches covering grounded dielectric slabs were simulated using Ansoft HFSS. Both rectangular and diamond unit cells were studied. For waves propagating along rectangular unit cells, the transverse cell dimension has no effect on the surface impedance or dispersion characteristics. For diamond unit cells, the surface impedance and dispersion characteristics vary significantly for different transverse cell lengths when the wave propagates along the shorter unit cell dimension. For waves propagating over the longer dimension, surface impedance and dispersion remain similar. Results show that at a given frequency, the impedance can be varied by changing the length of the cell in the propagating direction. For rectangular cells, impedance in orthogonal directions is independent of each other, and an anisotropic impedance tensor can be created based on the size and orientation of the cell.
  • Keywords
    anisotropic media; computational electromagnetics; dielectric materials; dispersion (wave); electromagnetic wave propagation; slabs; Ansoft HFSS simulation; anisotropic artificial impedance surface simulation; anisotropic impedance tensor; diamond lattices; diamond unit cell; dispersion characteristics; grounded dielectric slab; rectangular lattices; rectangular unit cell; surface wave propagation; transverse cell dimension; Diamond-like carbon; Dispersion; Geometry; Impedance; Lattices; Surface impedance; Surface waves; Artificial impedance surface; anisotropic impedance; diamond lattice; rectangular lattice;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Antennas and Propagation (APSURSI), 2011 IEEE International Symposium on
  • Conference_Location
    Spokane, WA
  • ISSN
    1522-3965
  • Print_ISBN
    978-1-4244-9562-7
  • Type

    conf

  • DOI
    10.1109/APS.2011.5996579
  • Filename
    5996579