In system programming, the future for high density devices

Author

Mitchell, Richard

Author_Institution

High Density Applic., Lattice Semicond. Corp., Milpitas, CA, USA

fYear

1994

fDate

27-29 Sep 1994

Firstpage

642

Lastpage

645

Abstract

In-System Programmability (ISP) is solving design challenges in many diverse applications such as very-high-density board configurations and multi-chip modules (MCMs). These applications can no longer use sockets, through-hole PGA´s, or even PLCC packages, and are rapidly moving towards fine-pin-pitch Quad Flat Packages (QFP) or no package at all. These new packaging trends address the device handling and programming issues, such as solderability and bent pin handling which designers currently face. This paper discusses ISP technology and the advantages of designing with Lattice´s ispLSI devices

Keywords

PLD programming; fine-pitch technology; integrated circuit packaging; integrated logic circuits; logic design; multichip modules; programmable logic devices; ISP technology; Lattice; MCM; fine-pin-pitch QFP; high density devices; in-system programmability; insystem programming; ispLSI devices; multichip modules; quad flat packages; Costs; EPROM; Lattices; Logic devices; Manufacturing; Packaging; Printed circuits; Prototypes; Random access memory; Sockets;

fLanguage

English

Publisher

ieee

Conference_Titel

WESCON/94. Idea/Microelectronics. Conference Record

Conference_Location

Anaheim , CA

ISSN

1095-791X

Print_ISBN

0-7803-9992-7

Type

conf

DOI

10.1109/WESCON.1994.403522

Filename

403522