Experimental evaluation of effect of global to local interaction on HDI solder joint deformation

Author

Lu, Hua ; Yeh, Chao-pin ; Dai, Jiabin

Author_Institution

Software Technol. Center, Motorola Inc., Schaumburg, IL, USA

fYear

1999

fDate

1999

Firstpage

469

Lastpage

474

Abstract

This paper study the solder joint thermal-mechanical deformation in a CSP affected by the remote constrains of the chip carrier. A novel digital speckle correlation is applied to directly measure solder joint shear strain without having to section the sample, and a phase shifting shadow moire is employed in obtaining warpage of the HDI substrate. Analysis is made based on the experimental findings, which suggests that the higher level constraints play a large part in solder joint deformation

Keywords

chip scale packaging; chip-on-board packaging; deformation; flip-chip devices; integrated circuit interconnections; moire fringes; soldering; speckle; CSP; HDI substrate warpage; chip carrier; digital speckle correlation; flip-chip-on-board; phase shifting shadow moire; shear strain measurement; solder joint; thermal-mechanical deformation; Aluminum; Assembly; Chaos; Chip scale packaging; Heat sinks; Integrated circuit interconnections; Semiconductor device measurement; Soldering; Strain measurement; Testing;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components and Technology Conference, 1999. 1999 Proceedings. 49th

Conference_Location

San Diego, CA

ISSN

0569-5503

Print_ISBN

0-7803-5231-9

Type

conf

DOI

10.1109/ECTC.1999.776217

Filename

776217