Interface logic package development: next generation packaging for today´s products

Developing new packages for interface logic devices requires that numerous goals be met if these packages are to become industry standards. Some of the more important goals that must be met are to minimize new equipment investment, achieve superior package design characteristics, and maintain consistent board level manufacturability. The industry standard QSOP package, developed by QSI meets these goals which has facilitated its acceptance as an industry standard. The second generation of interface logic packaging that has been developed with this new approach is the QVSOP, which is quickly becoming the next industry standard. Subsequent generations of interface logic packaging will certainly gain wider market acceptance by adhering to this new development methodology