DocumentCode
2935578
Title
Design and experimental evaluation of a skin-stretch haptic device for improved control of brain-computer interfaces
Author
Sketch, Sean M. ; Deo, Darrel R. ; Menon, Jayant P. ; Okamura, Allison M.
Author_Institution
Dept. of Mech. Eng., Stanford Univ., Stanford, CA, USA
fYear
2015
fDate
26-30 May 2015
Firstpage
272
Lastpage
277
Abstract
Robotic systems, such as prosthetics and exoskeletons, offer people suffering from motor impairments a chance to regain lost physical functionality. However, the neural control that individuals are able to exert over these robots is currently limited. This is due to both lack of control authority in many degrees of freedom and insufficient sensory feedback through the human-robot interface. We propose that haptic feedback is paramount for accurate and efficient control of robots via brain-computer interfaces (BCIs). Skin stretch at the fingertip is a novel form of haptic feedback for improving BCI-based robot control. In this paper, we describe the design of a BCI-driven skin-stretch device, assess several control paradigms for this device, and evaluate its effectiveness in a small user study. We show that BCI-based movement-intent classification improved in the presence of skin-stretch feedback for 3 of 4 healthy individuals controlling a computer cursor via an inexpensive, commercial electroencephalography-based (EEG) BCI.
Keywords
brain-computer interfaces; haptic interfaces; human-robot interaction; medical robotics; skin; BCI-based movement-intent classification; BCI-based robot control; BCI-driven skin-stretch device; EEG BCI; brain-computer interfaces; commercial electroencephalography-based BCI; computer cursor; degrees of freedom; exoskeletons; haptic feedback; human-robot interface; neural control; prosthetics; robotic systems; sensory feedback; skin-stretch haptic device; Computers; Electroencephalography; Force; Haptic interfaces; Robots; Skin; Trajectory;
fLanguage
English
Publisher
ieee
Conference_Titel
Robotics and Automation (ICRA), 2015 IEEE International Conference on
Conference_Location
Seattle, WA
Type
conf
DOI
10.1109/ICRA.2015.7139011
Filename
7139011
Link To Document