Title :
BATEL-ball grid array technologies for advanced telecom applications. I
Author :
Kelly, G. ; Schols, G. ; Herard, L. ; Allard, P. ; Van Hoof, W. ; Grenier, R. ; Smeyers, G. ; Altmann, R. ; Hayes, T. ; Egan, E. ; Wuyts, I.
Author_Institution :
Nat. Microelectron. Res. Centre, Univ. Coll. London, UK
Abstract :
This paper describes the development of advanced thin chip scale BGA technologies within Europe as part of the ESPRIT research project 24366 BATEL `Ball Grid Array Technologies for Advanced Telecom Applications´. LBGA 17×17 and LFBGA 12×12 with ball pitches of 0.8 mm have been developed using a matrix encapsulation technique. The materials, post mold warpage, electrical parasitics, and board level reliability have been characterised. Equipment for inspecting, handling and testing these fine pitch BGAs is described
Keywords :
ball grid arrays; encapsulation; fine-pitch technology; integrated circuit packaging; moulding; plastic packaging; 0.8 mm; BATEL; ESPRIT research project 24366; LBGA; LFBGA; ball grid array technologies; ball pitches; board level reliability; electrical parasitics; fine pitch BGAs; matrix encapsulation technique; post mold warpage; telecom applications; Assembly systems; Chip scale packaging; Electronic equipment manufacture; Electronic packaging thermal management; Electronics industry; Electronics packaging; Microelectronics; Plastic packaging; System testing; Telecommunications;
Conference_Titel :
Electronic Components and Technology Conference, 1999. 1999 Proceedings. 49th
Conference_Location :
San Diego, CA
Print_ISBN :
0-7803-5231-9
DOI :
10.1109/ECTC.1999.776243
