BATEL-ball grid array technologies for advanced telecom applications. I

Author

Kelly, G. ; Schols, G. ; Herard, L. ; Allard, P. ; Van Hoof, W. ; Grenier, R. ; Smeyers, G. ; Altmann, R. ; Hayes, T. ; Egan, E. ; Wuyts, I.

Author_Institution

Nat. Microelectron. Res. Centre, Univ. Coll. London, UK

fYear

1999

fDate

1999

Firstpage

613

Lastpage

618

Abstract

This paper describes the development of advanced thin chip scale BGA technologies within Europe as part of the ESPRIT research project 24366 BATEL `Ball Grid Array Technologies for Advanced Telecom Applications´. LBGA 17×17 and LFBGA 12×12 with ball pitches of 0.8 mm have been developed using a matrix encapsulation technique. The materials, post mold warpage, electrical parasitics, and board level reliability have been characterised. Equipment for inspecting, handling and testing these fine pitch BGAs is described

Keywords

ball grid arrays; encapsulation; fine-pitch technology; integrated circuit packaging; moulding; plastic packaging; 0.8 mm; BATEL; ESPRIT research project 24366; LBGA; LFBGA; ball grid array technologies; ball pitches; board level reliability; electrical parasitics; fine pitch BGAs; matrix encapsulation technique; post mold warpage; telecom applications; Assembly systems; Chip scale packaging; Electronic equipment manufacture; Electronic packaging thermal management; Electronics industry; Electronics packaging; Microelectronics; Plastic packaging; System testing; Telecommunications;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components and Technology Conference, 1999. 1999 Proceedings. 49th

Conference_Location

San Diego, CA

ISSN

0569-5503

Print_ISBN

0-7803-5231-9

Type

conf

DOI

10.1109/ECTC.1999.776243

Filename

776243