DocumentCode :
2936015
Title :
Response of elementary semiconducting structures to a terahertz electric field
Author :
Shen, Tao ; Wong, Thomas
Author_Institution :
Dept. of Electr. & Comput. Eng., Illinois Inst. of Technol., Chicago, IL, USA
fYear :
2011
fDate :
3-8 July 2011
Firstpage :
1613
Lastpage :
1616
Abstract :
With a bulk plasma frequency in the terahertz range, extrinsic semiconductors may be employed to form composites with tailored dispersion characteristic for fabrication of passive components in the terahertz band. Computations have been performed to study the polarization process in nanoscale semiconducting plates and spheres, employing a transport formulation to account for space charge effects. Results reveal a frequency dependent dipole moment that is influenced by the carrier density when it reaches the level of 1016 cm-3 and a size dependence as the characteristic length in field screening by the space charge is approached. To obtain higher contrast in dispersion effects resulting from the polarization of mobile charges, a material with lower intrinsic permittivity is preferred for developing composites with dispersion properties that are adjustable by composition variation and synthesis processes.
Keywords :
carrier density; composite materials; dispersion (wave); electric fields; electric moments; electromagnetic wave propagation; semiconductor materials; space charge waves; bulk plasma frequency; carrier density; composite material; composition variation; dispersion effect; elementary semiconducting structure; frequency dependent dipole moment; intrinsic permittivity; mobile charge polarization; nanoscale semiconducting plate; nanoscale semiconducting sphere; passive component; polarization process; space charge effect; synthesis process; terahertz electric field; terahertz electromagnetic wave propagation; Dispersion; Doping; Equations; Frequency dependence; Materials; Mathematical model; Plasmas;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Antennas and Propagation (APSURSI), 2011 IEEE International Symposium on
Conference_Location :
Spokane, WA
ISSN :
1522-3965
Print_ISBN :
978-1-4244-9562-7
Type :
conf
DOI :
10.1109/APS.2011.5996610
Filename :
5996610
Link To Document :
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